Install Thermal Compound Paste as Fast As Possible
Techquickie
·Techquickie
·2013-05-07
·
697 words · ~3 min read
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is that a camera get out of here when choosing a thermal compound you want to
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find something with low thermal resistance that is heat easily passes
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through it something non-conductive and non-capacitive so you don't short out
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anything on your motherboard and last but not least something that doesn't dry
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out over time so that you don't lose performance a couple of years down the
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road when your system's still running and your thermal compound still in there
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we'll be using IC Diamond this is my personal favorite thermal paste before
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you actually start a thermal compound swap I would definitely recommend
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checking your temperatures because that way you'll be able to more easily
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diagnose if anything went wrong during the installation procedure first step is
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to remove your existing heat sink revealing the old thermal compound
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underneath you'll need isopropyl alcohol
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so you want to wet that onto a nice soft
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piece of I use Charmin because it's awesome and then you want to clean the
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surface of the CPU as well as the bottom
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of the heat sink now you'll notice that I'm not actually able to get it
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completely clean on the first go this is
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because my wipe is now too dirty to clean anything so I'm going to find a
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clean spot put on some more alcohol and
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do another round with the isopropyl
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trying to remove the residue that was left from the first time of cleaning it
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so here we see our first pass and our second pass for the third pass I usually
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just use the toilet paper without putting any additional
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alcohol on it because we're trying to remove the little bits that are left
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behind not leave any more which is easier when they're wet and then I
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usually finish off and you're welcome to use something else with just a quick
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pass with my sleeve or a microfiber cloth to remove any remaining residue
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that might be left behind by toilet paper cuz those little bits can cause
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cooling problems and now you can see the surfaces are clean and ready to apply
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our new thermal compound back when CPUs
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didn't have integrated heat spreaders we used to spread the thermal compound out
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across the D or the core in order to make sure that it covered the entire
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thing now that we put so much mounting pressure onto our heat spreaders we can
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just put either a p-shaped blob in the middle or a rice grain shaped line in
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the middle and we can rely on the mounting pressure of the heat sink to
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actually spread the thermal compound so these are known as the p and the line
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method I personally find the line method has the best consistency for me but
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everyone has a different experience and it varies depending on the thermal
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compound the one thing to be aware of with the p and the line method is that
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if you have a bigger CPU you're going to want to apply a bigger line of thermal
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compound or a bigger p in the middle this is a 2011 CPU whereas the one down
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here is an 1155 CPU now that we have a
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fresh application of thermal compound and two nice shiny clean surfaces to put
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together we should be able to observe temperature improvements of anywhere from 3 to 5° C
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over the stock thermal compound when using an appropriate high performance
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thermal
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compound hey guys thanks for watching this episode of as fast as possible on
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