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is that a camera get out of here when choosing a thermal compound you want to

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find something with low thermal resistance that is heat easily passes

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through it something non-conductive and non-capacitive so you don't short out

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anything on your motherboard and last but not least something that doesn't dry

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out over time so that you don't lose performance a couple of years down the

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road when your system's still running and your thermal compound still in there

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we'll be using IC Diamond this is my personal favorite thermal paste before

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you actually start a thermal compound swap I would definitely recommend

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checking your temperatures because that way you'll be able to more easily

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diagnose if anything went wrong during the installation procedure first step is

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to remove your existing heat sink revealing the old thermal compound

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underneath you'll need isopropyl alcohol

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so you want to wet that onto a nice soft

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piece of I use Charmin because it's awesome and then you want to clean the

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surface of the CPU as well as the bottom

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of the heat sink now you'll notice that I'm not actually able to get it

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completely clean on the first go this is

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because my wipe is now too dirty to clean anything so I'm going to find a

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clean spot put on some more alcohol and

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do another round with the isopropyl

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trying to remove the residue that was left from the first time of cleaning it

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so here we see our first pass and our second pass for the third pass I usually

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just use the toilet paper without putting any additional

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alcohol on it because we're trying to remove the little bits that are left

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behind not leave any more which is easier when they're wet and then I

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usually finish off and you're welcome to use something else with just a quick

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pass with my sleeve or a microfiber cloth to remove any remaining residue

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that might be left behind by toilet paper cuz those little bits can cause

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cooling problems and now you can see the surfaces are clean and ready to apply

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our new thermal compound back when CPUs

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didn't have integrated heat spreaders we used to spread the thermal compound out

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across the D or the core in order to make sure that it covered the entire

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thing now that we put so much mounting pressure onto our heat spreaders we can

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just put either a p-shaped blob in the middle or a rice grain shaped line in

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the middle and we can rely on the mounting pressure of the heat sink to

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actually spread the thermal compound so these are known as the p and the line

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method I personally find the line method has the best consistency for me but

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everyone has a different experience and it varies depending on the thermal

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compound the one thing to be aware of with the p and the line method is that

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if you have a bigger CPU you're going to want to apply a bigger line of thermal

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compound or a bigger p in the middle this is a 2011 CPU whereas the one down

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here is an 1155 CPU now that we have a

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fresh application of thermal compound and two nice shiny clean surfaces to put

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together we should be able to observe temperature improvements of anywhere from 3 to 5° C

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over the stock thermal compound when using an appropriate high performance

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thermal

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compound hey guys thanks for watching this episode of as fast as possible on

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Techquickie if you enjoyed it make sure you subscribe and also don't forget to

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