is that a camera get out of here when choosing a thermal compound you want to
find something with low thermal resistance that is heat easily passes
through it something non-conductive and non-capacitive so you don't short out
anything on your motherboard and last but not least something that doesn't dry
out over time so that you don't lose performance a couple of years down the
road when your system's still running and your thermal compound still in there
we'll be using IC Diamond this is my personal favorite thermal paste before
you actually start a thermal compound swap I would definitely recommend
checking your temperatures because that way you'll be able to more easily
diagnose if anything went wrong during the installation procedure first step is
to remove your existing heat sink revealing the old thermal compound
underneath you'll need isopropyl alcohol
so you want to wet that onto a nice soft
piece of I use Charmin because it's awesome and then you want to clean the
surface of the CPU as well as the bottom
of the heat sink now you'll notice that I'm not actually able to get it
completely clean on the first go this is
because my wipe is now too dirty to clean anything so I'm going to find a
clean spot put on some more alcohol and
do another round with the isopropyl
trying to remove the residue that was left from the first time of cleaning it
so here we see our first pass and our second pass for the third pass I usually
just use the toilet paper without putting any additional
alcohol on it because we're trying to remove the little bits that are left
behind not leave any more which is easier when they're wet and then I
usually finish off and you're welcome to use something else with just a quick
pass with my sleeve or a microfiber cloth to remove any remaining residue
that might be left behind by toilet paper cuz those little bits can cause
cooling problems and now you can see the surfaces are clean and ready to apply
our new thermal compound back when CPUs
didn't have integrated heat spreaders we used to spread the thermal compound out
across the D or the core in order to make sure that it covered the entire
thing now that we put so much mounting pressure onto our heat spreaders we can
just put either a p-shaped blob in the middle or a rice grain shaped line in
the middle and we can rely on the mounting pressure of the heat sink to
actually spread the thermal compound so these are known as the p and the line
method I personally find the line method has the best consistency for me but
everyone has a different experience and it varies depending on the thermal
compound the one thing to be aware of with the p and the line method is that
if you have a bigger CPU you're going to want to apply a bigger line of thermal
compound or a bigger p in the middle this is a 2011 CPU whereas the one down
here is an 1155 CPU now that we have a
fresh application of thermal compound and two nice shiny clean surfaces to put
together we should be able to observe temperature improvements of anywhere from 3 to 5° C
over the stock thermal compound when using an appropriate high performance
thermal
compound hey guys thanks for watching this episode of as fast as possible on
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