What is a Heatsink as Fast As Possible

Techquickie ·Techquickie ·2014-05-07 · 986 words · ~4 min read
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0:00 Modern electronics pack an incredible amount of complexity into a very small
0:04 space which creates a lot of heat. Heat that if left unchecked could reduce the
0:09 lifespan or even destroy outright the
0:13 processor that created it. That's why when you first open up a PC or other
0:16 electronic device, one of the first things you'll see is one or more large
0:21 metal objects called heat sinks. Inside a PC, heat sinks will be found on the
0:25 CPU, graphics card, motherboard, inside the power supply, and even in other
0:30 places as needed. As you can see, they can look very different from each other,
0:35 but they all serve the same basic purpose, to remove heat from delicate
0:39 components and extend their lifetimes. Let's walk through some of the different
0:43 kinds of heat sinks you might encounter. First up is the heat spreader. This is
0:47 the most basic heat sink, and it consists of a simple flat piece of
0:51 metal. It only moderately improves heat dissipation. Because while metal will
0:55 transfer heat to the surrounding air faster than plastic, it would be much
0:59 more effective if it also increased the size of the area of the surface that's
1:04 being used to transfer that heat. That leads us to our next common type,
1:08 passive pinned or finned heat sinks. These are basically heat spreaders with
1:13 structures on top of them that dramatically increase the surface area
1:17 that can be used to dissipate heat to the surrounding air. They are much more
1:21 effective than heat spreaders, but they are also more expensive to make and they
1:25 take up more space. Speaking of taking up space, adding a fan to blow air
1:29 directly at a thinned or pinned heat sink is relatively inexpensive and very
1:34 space efficient as a means of dramatically improving heatsink
1:38 performance. For this reason, actively cooled thinned heat sinks are one of the
1:43 most common types of heat sinks found in PC systems where size and cost are major
1:49 design factors. Speaking of cost, the most effective and the most expensive
1:54 common type of heat sink in a PC is a heat pipe or vapor chamber heatsink. For
1:59 very hot components like CPUs or graphics cards, the limiting factor of a
2:05 standard thinned heat sink's performance is no longer the speed at which the fins
2:10 can be used to dissipate heat to the air, but rather the speed at which the
2:14 heat can be moved away from the very small processor core to the fins in the
2:19 first place. Heat pipes and vapor chambers usually consist of an outer
2:23 copper wall and a material inside that is constantly changing phases between
2:28 liquid and gas. They can be used to carry heat away from a small heat source
2:33 extremely quickly to a large array of heatsink fins where it can be dissipated
2:37 to the air. So far, I've talked mostly about surface area and how that helps,
2:41 but there are other factors that affect heatsink performance. For example,
2:46 copper performs better than aluminum as a heatsink material. And among aluminum
2:51 alloys, some of them are better than others. But the material selection, like
2:56 many of these other factors, cannot be controlled by anyone other than the
3:00 manufacturer. So might not be that useful to you. But what can you do to
3:04 improve your heatsink's performance? Number one is to lower the ambient
3:08 temperature. If cracking open a window lowers the room temperature by 5°, it
3:13 will lower your heat sink temperature by about 5°. Number two is more air flow.
3:18 The faster the air moves over the heatsink, the better it will perform.
3:22 Number three is better thermal interface material. No two pieces of metal will
3:27 ever meet up perfectly, and thermal interface materials fill in these micro
3:31 gaps for better heat conduction or better heat transfer between them.
3:35 Replacing the subpar solutions that come pre-installed on your components with
3:39 high performance aftermarket thermal compound can easily lower temperatures
3:43 by several degrees or more. Number four is mounting. A good solid mount improves
3:48 the contact between a chip and a heatsink and ensures effective thermal
3:53 transfer. Often a heatsink that isn't performing as expected is being held
3:57 back by an air bubble trapped in between or a small component nearby that is
4:03 interfering with the heatsink's mounting pressure. Speaking of mounting pressure,
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4:55 fast as possible on heat sinks. Like the video if you liked it, dislike it if you
4:59 disliked it. Leave a comment and let me know if you learned something. And maybe
5:02 tell me what it was. Or if you didn't learn something, maybe tell me what you didn't learn. I don't know. The more
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