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Intel is, quite literally, about to flip the modern CPU upside down.

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Next year, they're going to be introducing a dramatic-sounding piece of technology

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called PowerVIA to their new processor lineups,

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and it looks like the wave of the future, not just for Intel CPUs,

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but products from other chip makers as well. Okay, Riley, you've got my attention.

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Tell me what's so great about it, is what you just said, probably.

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PowerVIA, or backside power delivery, to use a less Intel-specific term,

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is all about the tiny wires connected to your CPU's transistors,

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the parts that allow your CPU to think. Current CPUs have separate wires for power and data

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that both point downwards towards the socket. However, this method of CPU fabrication

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presents a few problems. One is that having power and signal wires

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so close to each other results in interference and, therefore, degraded performance.

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Another is that the wires used for power delivery have a natural resistance to them,

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and as we've put more and more transistors on our chips, we've had to make these wires smaller and smaller,

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which creates even more resistance, with the result being undesirable voltage drops

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that also limit performance. Trying to pack in so many small wires

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also increases cost and manufacturing complexity,

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as chip makers have to use very expensive lithography

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in order to meet their goals. So instead of just continuing to fight this problem

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more and more as transistors keep getting smaller,

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backside power delivery works smarter, not harder,

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and further separates power and signal wires.

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A chip built with backside power delivery has the signal wires coming out of the front side

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of the wafer the transistors sit on, with the power wires coming out of the bottom or backside.

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In the previous method we discussed, all wires come out of the front side,

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though, confusingly, usually the chip is flipped the other way, so the front side extends

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towards the CPU socket, with the transistors back near the heat spreader

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so they could be cooled down. It's all a little wacky.

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Chip engineers like to have fun, you know. With backside power delivery,

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although you do have a few signal wires still coming off the backside to allow the CPU

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to communicate with the rest of the system, the large majority of those signal wires

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are internal CPU transistor to transistor connections,

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which are placed on the front side. Intel has to polish the wafer down very thin

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in order to expose power connections to build out backside power delivery,

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meaning a dummy carrier wafer is bonded to the front side

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to give the whole stack structural support. It's like a really solid sandwich you should not eat.

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This mitigates the issues of interference and voltage drop we discussed earlier.

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Intel claims this results in a little over 5% higher core frequency on e-cores

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than would otherwise be possible, and gains on the higher performance P-cores

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should be similar. Another big advantage is because you're not trying to fit

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as many wires as you can into a certain space, manufacturing is cheaper and easier.

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Of course, since backside power delivery is a new fabrication method,

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there's an associated cost with rolling it out. But Intel says that the savings that come as a result

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of the overall easier manufacturing will more than offset this.

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Throw in the fact that Power Viya means you can fill more of the die with actual library cells,

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groups of transistors that process data, rather than blank space,

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and it isn't hard to see why Samsung and TSMC are also working to get their own chips

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featuring backside power delivery to market. I mean, this all sounds pretty great,

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but are there any downsides for the consumer? The one that has stuck out to some enthusiasts

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is that there are now quite a few layers of front side wiring separating the transistors

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from where a CPU cooler would sit. Intel claims that there's enough thermal conductivity

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through these layers to make cooling CPUs with Power Viya

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no more difficult than more traditional chips, but that remains to be seen.

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We should expect the first Intel chips with Power Viya to hit the market in mid-2024,

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with chips featuring backside power delivery from other manufacturers coming at least

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a couple years later. Comment down below if there are more topics in chip making you'd like us to tackle,

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but for now, all this talk about chips and wafers is really making me want some snacks.

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It's snack time for Riley. It's also time to thank you for watching this video.

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Hey, like it if you liked it, dislike it if you disliked it, that's okay,

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but you know, if you do do that, you might as well check out our other videos,

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comment below the video suggestions, and don't forget to subscribe and follow. I mean, it's the least you could do.
