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Upgrading your laptop's RAM is a pain, but thanks to CAM2, an updated standard

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recently ratified by Jedeck, that might be about to change.

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CAM, or the compression attached memory module,

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is a memory form factor created by Dell engineer Tom Schnell.

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You might remember it launching as a proprietary solution in Dell laptops in 2022, replacing the SODIM form factor.

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SODIM technically stands for Small Outline Dual Inline Memory Module,

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but it just sounds like we're calling them stupid. And we are.

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To their credit, DIMMs were a significant upgrade when they started to replace SIMs back in the 1990s.

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SIM pins could only support 32-bit data,

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while DIM pins could manage 64-bit,

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meaning that a single DIM could do the job of two SIMs.

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SODIM is basically the same thing, just smaller, around half the size,

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which is why it's primarily used in laptops. Compared to memory soldered to the motherboard,

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replaceable components like SODIM RAM sticks typically aren't as resistant to accidental jostling,

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they use more power, and they take up more space. In a portable device, where space is at a premium

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and cooling is already a problem, this has led to soldered memory becoming the default

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at the expense of repairability and upgradeability.

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Most users will never open the back end of their device, so many manufacturers have decided that it makes more sense

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to ensure that it works today rather than it be upgradeable in the future.

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But for those of us who'd rather upgrade a laptop that just needs a bit more RAM

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rather than buy a whole new machine, it's a big disappointment.

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So how does CAM2 address those problems? And can it really bring back upgradeable laptop RAM?

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Dell's CAM, and the now standardized CAM2,

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is an attempt to close the gap between replaceable and soldered memory.

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Looking at the original CAM and SODIM side-by-side,

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you're probably gonna notice one big difference right away, the size.

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The single CAM component is significantly longer and wider,

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but it's also 57% thinner for an equivalent amount of RAM,

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shaving off a few millimeters of height and reducing overall volume.

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CAM and CAM2 can also support up to 128 gigabytes

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on a single module, and have significant improvements over SODIM

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in terms of airflow. You might wonder why SODIM comes with RAM chips

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mounted on both sides of the PCB like that if height is such an important factor,

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but this is actually a way of accommodating yet another technical limitation of the format.

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SODIM uses an edge connector, which means that traces for the chips

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nearest to the connector need to zigzag in order to keep them the same length

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as traces to chips on the far side. That increases both the time it takes the motherboard

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to communicate with those chips and the risk of signal distortion and crosstalk

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between circuits. As traces get longer, you need to increase the space between them

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in order to manage that risk. Therefore, a double-sided PCB is the best way

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to save space given the other constraints of the design. Even worse, due to these same size constraints

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and timing issues, the wires from the CPU wind up traveling

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under the SODIM module and connecting to the far side,

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leading to a minimum trace length of 7.5 centimeters.

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CAM and CAM2, on the other hand, use a land grid array connector similar to a typical CPU.

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Because it has connecting pins across its rear face rather than on one edge,

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all the chips are now significantly closer to the connector and the motherboard.

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Further, CAM2 comes in configurations for two single channels or one dual channel.

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In part due to this connector change, CAM2 will also need to be screwed down

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in order to ensure it maintains consistent contact, which has both advantages and disadvantages.

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It reduces the potential that the component might come unseated due to jostling,

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but it also adds the need for a screwdriver, like this one from lttstore.com,

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rather than just easily slotting in like a SODIM.

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Likewise, depending on the design of their device, some users might need to replace their existing CAM2

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with a new one when they wanna upgrade rather than simply buying a second SODIM

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and plugging it in. Another reason why some companies are pushing for CAM2 now

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is SODIM actually has a speed cap of around 6,400 megahertz.

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Most mainstream SODIM designs haven't hit this ceiling yet,

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but it's a future problem that CAM is solving today

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with a proactive design that places the module in closer contact with the motherboard.

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On the level of electronics and materials, CAM and SODIM are extremely similar,

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meaning that they'll likely be similar in terms of price to performance

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and software interoperability. Now as for power efficiency,

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the CAM2 standard also comes with both DDR5

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and LPDDR5 slash 5X designs,

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while SODIM is limited to the more power intensive DDR5.

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In order to prevent anyone from accidentally crossing the streams, which may lead to a total protonic reversal,

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the slots for DDR5 and LPDDR5 versions of CAM2

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will be physically distinct to prevent one from getting plugged into the other.

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The option of LPDDR5 might mean we'll see more

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upgradable RAM even in relatively small devices like tablets or single board computers.

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It's unclear at this point whether CAM2 is truly the default laptop memory format of tomorrow,

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but thanks to this new ratification by JEDEC, it will likely gain interest and become cheaper over time.

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Dell is of course a major backer of the new standard,

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but Samsung and Micron also announced plans to incorporate CAM modules in upcoming products,

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even prior to the ratification of CAM2. Wow, maybe we really are in the best timeline.

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But one thing's for sure, you are the best viewer for watching all the way to the end.

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Wow, thanks for watching. Like the video if you liked it, dislike it if you disliked it.

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