chip stacking worked well for pringles and now electronics manufacturers are
also using chip stacking to make your gadgets more powerful than ever and just
to be clear i'm not talking about some new type of CPU where you can stack
multiple processors out of a box on top of each other like jenga on your
motherboard i'm talking about stacking in the actual dies and connecting them
in some way to add functionality this concept has been somewhat common for a
while in the storage world it's easy these days to get an SSD for your
computer that uses die stacking in order to fit more capacity onto one drive such
as with vnand from samsung but perhaps even more interesting is that we're
starting to see dye stacking on processors as well
though Intel and AMD are taking slightly different approaches to implementing it
in your next CPU let's start by talking about Intel's 3d
stacking technology called bovaros we first saw this on Intel's lakefield
chips which were actually hybrid cpus
that is they combined both high power and low power cores in an attempt to
save energy as they were mostly designed with laptops in mind lakefield
implements foveros by having a base die with support logic including security
and io placed beneath a compute die that contains the actual CPU cores connecting
them you have these tiny balls
of solder called micro bumps whose centers are only 36 microns apart that's
about half the width of a human hair but why is this better than just having two
separate dies on the same 2d plane similar to the chiplet technique that
we've seen with AMD's epic processors well it turns out that getting the dies
as close as they can physically be to each other results in some real
performance benefits and having micro bumps that are that small allows the
dyes to be super close to each other and communicate more quickly not only that
but having the dies so close together also means you don't need as much power
to move data between them so not only is stacking dies faster than
just having them on a single 2d surface it's also easier on your battery life
unlike Intel their die stacking strategy is not to link a compute die in a base
die instead AMD is concentrating on using 3d chip design to increase the
amount of cash available to the CPU at least for now you can learn more about
CPU cache in this episode but the gist of it is that it's a really fast kind of
memory that sits inside the CPU package enabling the processor to quickly access
information it needs to work on immediately team red recently announced
they'll be stacking additional cash on top of the existing cache in each
chiplet instead of using micro bumps like Intel they're instead linking the cache layers
via through silicon vias or tsv's these
are exactly what they sound like a copper connection that goes through each
layer of silicon like a toothpick going down through the layers of a juicy
burger now i'm hungry it's almost lunch time you can fit more tsv's per unit of
area than foberos micro bumps which AMD is hoping will give them a leg up
against Intel although they're obviously not used in die stacking in the same way
as team blue AMD thinks the increased cache sizes will lead to significant
performance gains each chiplet can now feature up to 96 megabytes of level 3
cache so a CPU with 12 or 16 cores across two chiplets will have a full 192
megabytes a staggering amount compared to conventional technology because CPU
cache is so fast having more of it as well as higher bandwidth could mean real
world benefits with AMD already claiming anywhere between 4 and 25 percent more
frames per second in games compared to the ryzen 9 5900x
only time will tell which of these techniques or another one we don't even
know about yet will really push the limits of performance over the years
maybe at some point we'll be able to game at 16k effortlessly thanks to gpus
that look like club sandwiches and you'll be able to game effortlessly with
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