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chip stacking worked well for pringles and now electronics manufacturers are

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also using chip stacking to make your gadgets more powerful than ever and just

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to be clear i'm not talking about some new type of CPU where you can stack

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multiple processors out of a box on top of each other like jenga on your

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motherboard i'm talking about stacking in the actual dies and connecting them

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in some way to add functionality this concept has been somewhat common for a

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while in the storage world it's easy these days to get an SSD for your

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computer that uses die stacking in order to fit more capacity onto one drive such

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as with vnand from samsung but perhaps even more interesting is that we're

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starting to see dye stacking on processors as well

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though Intel and AMD are taking slightly different approaches to implementing it

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in your next CPU let's start by talking about Intel's 3d

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stacking technology called bovaros we first saw this on Intel's lakefield

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chips which were actually hybrid cpus

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that is they combined both high power and low power cores in an attempt to

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save energy as they were mostly designed with laptops in mind lakefield

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implements foveros by having a base die with support logic including security

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and io placed beneath a compute die that contains the actual CPU cores connecting

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them you have these tiny balls

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of solder called micro bumps whose centers are only 36 microns apart that's

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about half the width of a human hair but why is this better than just having two

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separate dies on the same 2d plane similar to the chiplet technique that

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we've seen with AMD's epic processors well it turns out that getting the dies

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as close as they can physically be to each other results in some real

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performance benefits and having micro bumps that are that small allows the

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dyes to be super close to each other and communicate more quickly not only that

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but having the dies so close together also means you don't need as much power

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to move data between them so not only is stacking dies faster than

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just having them on a single 2d surface it's also easier on your battery life

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unlike Intel their die stacking strategy is not to link a compute die in a base

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die instead AMD is concentrating on using 3d chip design to increase the

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amount of cash available to the CPU at least for now you can learn more about

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CPU cache in this episode but the gist of it is that it's a really fast kind of

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memory that sits inside the CPU package enabling the processor to quickly access

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information it needs to work on immediately team red recently announced

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they'll be stacking additional cash on top of the existing cache in each

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chiplet instead of using micro bumps like Intel they're instead linking the cache layers

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via through silicon vias or tsv's these

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are exactly what they sound like a copper connection that goes through each

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layer of silicon like a toothpick going down through the layers of a juicy

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burger now i'm hungry it's almost lunch time you can fit more tsv's per unit of

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area than foberos micro bumps which AMD is hoping will give them a leg up

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against Intel although they're obviously not used in die stacking in the same way

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as team blue AMD thinks the increased cache sizes will lead to significant

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performance gains each chiplet can now feature up to 96 megabytes of level 3

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cache so a CPU with 12 or 16 cores across two chiplets will have a full 192

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megabytes a staggering amount compared to conventional technology because CPU

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cache is so fast having more of it as well as higher bandwidth could mean real

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world benefits with AMD already claiming anywhere between 4 and 25 percent more

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frames per second in games compared to the ryzen 9 5900x

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only time will tell which of these techniques or another one we don't even

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know about yet will really push the limits of performance over the years

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maybe at some point we'll be able to game at 16k effortlessly thanks to gpus

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that look like club sandwiches and you'll be able to game effortlessly with

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redux redox offers hardware with no markup pricing only a 75 build fee the

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small build fee and won't cut corners on quality you get a two year warranty for

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arts and labor and you can use the online pc builder to customize what's

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today thanks for watching guys like dislike check out our other videos like

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